Shenzhen Hongwei High Frequency Technology Co., Ltd.
We design and build Blister Thermoforming, Sealing and Packing Equipment as per client's requirement based on the conditions of product to Optimize Production for Lower Cost and Higher Productivity
Work Flow Procedure 1. Film Unwinding feed, 2. Film heating, 3. Blister themal molding, 4. Punching hole, 5. Punch wafer and place it on Ultrasonic .....
Work Flow Procedure 1. Film Unwinding feed, 2. Film heating, 3. Blister themal molding, 4. Punching hole, 5. Punch wafer and place it on Ultrasonic .....
Work Flow Procedure 1. Film Unwinding feed, 2. Film heating, 3. Blister themal molding, 4. Punching hole, 5. Punch wafer and place it on Ultrasonic .....
Work Flow Procedure 1. Film Unwinding feed, 2. Film heating, 3. Blister themal molding, 4. Punching hole, 5. Punch wafer and place it on Ultrasonic .....
Work Flow Procedure 1. Film Unwinding feed, 2. Film heating, 3. Blister themal molding, 4. Punching hole, 5. Punch wafer and place it on Ultrasonic .....